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Qualcomm is pushing out XR2 chips faster than VR headsets can use them

Qualcomm is pushing out XR2 chips faster than VR headsets can use them

What you need to know

  • Qualcomm is reportedly shipping new XR2 and XR2+ Gen 3 chips to VR HMDs.
  • These Project Matrix chips are said to support 16GB of RAM, UFS 4.0 storage, and 4K displays, and may use Oryon CPUs.
  • The Snapdragon XR2+ Gen 2 was announced in early January and has yet to appear in consumer products.

Qualcomm has reportedly begun testing and testing its Snapdragon XR2 Gen 3 and XR2+ Gen 3 chips designed for the next generation of VR headsets. This leaked news surprised us, given that a Gen 2 chip has yet to make its way into the hands of consumers.

WinFuture’s Roland Quandt first posted on X about Project Matrix, the company’s “next-generation AR/VR chips,” on May 17. Specifically, he explained how the higher-end SXR2350 will support 16GB of RAM, UFS 4.0 storage, and 4K displays.


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Image Source : www.androidcentral.com

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